Temperature characteristics are one of the key parameters determining the performance of MEMS pressure sensor under specific operating conditions. This research demonstrates a new microassembly design for differential pressure sensor with adjustable ranges of 10u202660 kPa. A distinguishing feature of this microassembly is its use of stops for pressure sensor chip with sensitivity of S = 0.61 ± 0.15 mV/V/kPa. Developed pressure sensor enables to withstand proof pressure of 1.5 MPa. The proposed base geometry of the microassembly significantly reduces the impact of residual mechanical stresses (RMS) by all mechanical connections of pressure sensor chip, which is subjected to thermocycling and barocycling. It has been proven that it is possible to achieve errors in the temperature hysteresis of the zero signal (THZ) of less than 0.25%/FS in a wide temperature range from -65u2070С to +85u2070С, despite the requirement of top mechanical stop (as an additional source of RMS), which is only necessary to increase the overload capacity of pressure sensor.